Impedance Control PCB Manufacturing
What is Impedance?
Impedance is the effective resistance of an electric circuit to alternating current, arising from the combined effects of Ohmic Resistance and Reactance. Transmission lines are for signal delivery in PCB and its Impedance depends on the length and width of the lines and also the insulation base material called substrate.
What is Control Impedance?
Unless you have carefully designed the trace and its environment, impedance is typically “uncontrolled”, meaning that impedance will vary in value from point to point along the trace.
At high frequencies, PCB traces do not behave like simple connections, controlled impedance helps us ensure that signals are not degraded as they route around a PCB.
Essentially, controlled impedance is the matching of substrate material properties with trace dimensions and locations to ensure the impedance of a trace’s signal is within a certain percentage of a specific value. Control impedance boards provide repeatable high-frequency performance.
Applications of Control Impedance PCB Boards
Controlled Impedance should be considered for PCBs used in fast digital applications such as:
– Telecommunications
– Computing 100MHz and above
– High Quality Analog Video
– Signal Processing
– RF Communication
Impedance control parameter
It is very convenient for customers to conduct impedance matching design according to the standard laminated structure and related parameters, the PCB will be produced in accordance with the following stack up strictly.
Please don’t hesitate to contact us by email if you need more information about impedance control solutions.
Refer to the following example.
Controlled Impedance PCB Parameters and Stack up
1.Prepreg dielectric constant:
Prepreg type | Dielectric constant |
2313 | 4.05 |
2.Solder mask Parameters
Solder mask thickness over the laminate | Solder mask thickness over traces | Solder mask dielectric constant |
0.8mil | 0.5mil | 3.8 |
- 4 layer board , 1.0 mm board thickness, 2313 Stackup:
Layer | Material Type | Thickness |
|
Top Layer1 | Copper | 0.035 mm | |
Prepreg | 2313*1 | 0.1 mm | |
Inner Layer2 | Copper | 0.0175 mm | 0.7 mm (with copper core) |
Core | Core | 0.665 mm | |
Inner Layer3 | Copper | 0.0175 mm | |
Prepreg | 2313*1 | 0.1 mm | |
Bottom Layer4 | Copper | 0.035 mm |
- 4 layer board , 1.6 mm board thickness, 2313 Stackup:
Layer | Material Type | Thickness |
|
Top Layer1 | Copper | 0.035 mm | |
Prepreg | 2313*1 | 0.1 mm | |
Inner Layer2 | Copper | 0.0175 mm | 1.3 mm (with copper core) |
Core | Core | 1.265 mm | |
Inner Layer3 | Copper | 0.0175 mm | |
Prepreg | 2313*1 | 0.1 mm | |
Bottom Layer4 | Copper | 0.035 mm |
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